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Pashai, Naseem

Major: 
Electrical Engineering

What is the RISE area of interest during your first year and why?: 

My area of interest for the first year of RISE is Instruction. I believe that interactive, hands-on instruction is one of the best ways an individual can develop their leadership skills. I have always been passionate about teaching and working with students when it comes to STEM concepts. This past summer, I interned at the United States Army Research Laboratory where I was involved in an educational outreach program. I quickly gathered that the classroom environment is definitely one of the most effective ways I practice my strengths in leadership skills.

What is the RISE area of interest during your second year and why?: 

My area of interest for the second year of RISE is Service. The RISE program itself encourages and puts a huge emphasis on giving back to the community, and I would definitely like to involve that in my leadership experience over the course of the next two years. I think that service is an incredibly impactful way to build upon and strengthen leadership skills.

What are your involvements and or extracurricular activities?: 

During the academic year, I am actively involved in the University of Maryland Iranian Student’s Foundation (ISF). Last year, I served on the executive board of ISF as the Vice President of Programming, and this year, I will be taking on the role of President. ISF is a social organization devoted to maintaining and spreading Persian history and culture to its member-base as well as the broader UMD campus and outer Iranian community.

For the past two years, over the summer, I interned at the U.S. Army Research Laboratory in Adelphi, MD (ARL) within the Sensors and Electronics Department on the Flexible Hybrid Electronics subteam. This past summer, I worked with MIT Lincoln Laboratory to study the effects of photonic sintering on the conductivity of 3D printed silver nanoparticle ink. Our research aims to realize an improvement in conductivity of direct-write, 3D printed silver ink. My team more broadly focuses on ultimately constructing 3D printing flexible sensing devices for the Warfighter.

What is your cool engineering experience?: 

My cool engineering experience definitely stems from my research at the U.S. Army Research Lab. Between the past two summers; I had the opportunity of constructing a temperature sensing circuit prototype to be 3D printed on non-conventional, flexible substrates for soldier sensing applications. I was also able to test the conductivity of 3D printed metallic traces after shooting high-energy short pulses of light at test substrates.